Ceramic Package Substrate Sintering: Why Specialized Graphite Molds Demand Precision Machining Solutions
Industry Background & Application Scenarios: The Critical Role of Graphite Molds in Ceramic Packaging Ceramic package substrates are indispensable in high-reliability electronics, including power modules, LEDs, and automotive sensors. Their sintering process requires graphite molds to withstand temperatures exceeding 1,600°C while maintaining dimensional stability to ±5 μm. Unlike metal molds, graphite’s low thermal expansion coefficient […]